China AI compute news centers on memory, packaging and power infrastructure
China-related AI compute updates focused on domestic memory demand, advanced packaging cooperation, optical and power-market infrastructure, and new model releases.
• ByteDance reportedly signed a five-year memory supply deal with CXMT worth more than $7 billion, while CXMT is said to be building two plants in Shanghai and Hefei that would double output to more than 600,000 wafers a month.
• GIGABYTE said its full DDR5 motherboard lineup now supports memory modules based on CXMT DRAM dies, with Intel 800- and 700-series boards supported in factory BIOS and AMD boards supported through AGESA 1.3.0.1c and GIGABYTE optimization.
• Lens Technology signed a memorandum of cooperation with Intel to discuss TGV advanced packaging, including glass substrate via formation, high-precision laser processing, metallized via deposition and multilayer interconnect routing.
• Huawei said transport capacity is the biggest bottleneck for AI computing power rather than single-chip process nodes, as it outlined an integrated computing-storage-network foundation and Ascend open-source ecosystem plans.
• Hong Kong property firm ITC signed a memorandum to build a 1GW data center near Shanghai, with development planned in phases over five years.
• China's National Energy Administration called for stronger oversight of energy supply during the summer peak and improvement of the unified national electricity market system, including tighter retail electricity market management.
• Zhongji Innolight launched its public offering on the Hong Kong Stock Exchange, while Cambridge Technology plans to invest 800 million yuan in a fund focused on optical components, chips and core ICs among other sectors.
• Ant Group released Ling-3.0-flash, a 124B-parameter native hybrid reasoning model with 5.1B activated parameters, and Alibaba Cloud open-sourced OvisOCR2, a 0.8B document parsing model.