China pushes compute interconnection as chip and memory supply chains advance
China’s AI compute sector saw new interconnection and optical-network moves, while domestic chipmakers and policy officials highlighted progress in core components and computing infrastructure.
• The Ministry of Industry and Information Technology named 17 regional nodes for the national computing power interconnection system, under the “1+M+N” architecture.
• Shanghai’s AI computing optical network program took effect, adding another infrastructure push for compute connectivity.
• TCL CSOT said it will enter optical communications through indium phosphide laser chips, then expand into optical devices and modules, citing rapid AI data-center growth.
• The NDRC said China’s integrated-circuit industry is making breakthroughs in high-end design and manufacturing, with specialty processes, advanced packaging and memory also advancing.
• Loongson Technology reported first-half revenue of 272 million yuan, up 11.64% year on year, but still posted a net loss attributable to shareholders of 224 million yuan.
• AI-related demand continued to reshape the global chip supply chain, with Counterpoint saying the pure-play foundry market grew 29% year on year in Q2 and TSMC held 73% share.