Huawei Ascend order and domestic models lead China AI compute news
China’s AI compute updates centered on domestic chip procurement, model releases, semiconductor financing and AI infrastructure supply-chain moves.
• Fanshi Intelligence reportedly reached a large-scale computing power order with Huawei and will invest more than 1 billion yuan to buy Ascend 950 chips for AI foundation model deployment in fields including finance and manufacturing.
• Baidu CFO He Haijian said AI-related revenue now spans cloud computing, applications and other businesses and accounts for more than half of Baidu’s total revenue, with new GPU cluster investments expected to be recouped within two to three years.
• Centec Networks plans a private placement to raise up to 4.805 billion yuan for next-generation high-performance switching chips and other projects.
• iFlytek open-sourced its Ciyuan Spark X2.5-4B and X2.5-1.7B on-device models, saying both support up to a 1 million-token context window and were trained on a fully domestic computing power platform.
• China released Smart Chemical Industry Large Model 3.0 Pro, jointly developed by the Dalian Institute of Chemical Physics, iFlytek and Alibaba Cloud, shifting the model from knowledge Q&A toward task planning, execution and verification.
• Sunshine Co. said a controlled subsidiary signed a 633 million yuan integrated server leasing services contract.
• InnoLux unveiled a Chip Last FOPLP advanced packaging platform for AI and HPC and said mass production is expected in the second half of 2027.
• NVIDIA and MediaTek expanded their partnership, with MediaTek set to use NVIDIA’s NVLink Fusion platform to help hyperscalers, cloud providers and frontier model developers build custom XPUs for rack-scale AI infrastructure.