Chinese AI-chip funding and compute capacity plans advance
China’s AI-compute sector saw new investment, capacity expansion and policy activity across chips, packaging, photonics and compute leasing.
• Zhejiang Governor Liu Jie called for faster development of general-purpose and vertical large models, AI agents, high-quality datasets and “AI + manufacturing,” alongside coordinated growth across chips, models and applications.
• Changdian Technology plans to raise up to 6.5 billion yuan through a private placement to expand advanced-packaging capacity for high-performance computing.
• Enflame, one of China’s domestic GPU companies, set its STAR Market IPO price at 142.18 yuan per share, offering 43,035,173 shares and targeting gross proceeds of 6.119 billion yuan.
• Xingyun Technology signed a compute-leasing agreement worth 922 million yuan.
• Guoke Guangxin completed a Series B+ round worth several hundred million yuan to develop silicon-photonic and chiplet products, expand data-communications production and plan overseas delivery centers.
• Montage Technology said Samsung and SK Hynix have adopted its CXL 3.2 chips; the company also reported first-half revenue of 3.335 billion yuan and net profit attributable to shareholders of 1.997 billion yuan.
• Union Memory launched the UM301a, a DRAM-less PCIe Gen4 enterprise boot SSD in capacities up to 1.92TB, with sequential read speeds of up to 5,000MB/s.
• NVIDIA agreed to acquire Hugging Face for $12.9303 billion, with the companies planning to expand the platform and its infrastructure while keeping the model hub open; the deal is expected to close in the first half of 2027.