NearLink's high-bandwidth SLB 2.0 reportedly set for commercialization in late 2026, with routers coming soon
IT Home reported on October 25 that NearLink's high-bandwidth SLB 2.0 is expected to enter commercial use by the end of 2026, with NearLink routers also coming soon, according to a post that day by blogger @Adak封狼居胥. The blogger said Beijing Zhongke Jingshang Technology is investing heavily in NearLink 2.0 chip development, and its NearLink solutions for applications including embodied AI are moving rapidly toward commercialization. Its high-bandwidth SLB 2.0 chip is expected to make its commercial debut in December 2026, accelerating the adoption of NearLink access points and routers. As IT Home previously reported, at the China Appliance & Electronics World Expo in March 2024 (AWE 202…
Source: IT之家