Oriental Semiconductor has released its Computing Power Server Power Supply System White Paper, outlining its product portfolio for primary, secondary and tertiary power supplies in computing power servers, as well as its technology roadmap for 48V, 800V and higher-voltage power architectures.

The white paper shows that the company is building a server power supply portfolio comprising power devices and digital control chips, spanning primary power supply units, or PSUs, intermediate bus converters, or IBCs, and voltage regulator modules, or VRMs.

Primary Power: High-Voltage Input and Rack-Level Power Delivery

The white paper discusses the potential use of these devices in high-voltage input, 800V high-voltage direct-current and solid-state-transformer architectures. Oriental Semiconductor identifies 800V commercialization as a medium-term objective rather than a currently deployed product offering.

These products aim to reduce energy losses during power conversion and meet the power delivery needs of high-power AI servers and full server racks.

Secondary Power: Converting the 48V Bus Voltage

For secondary power supplies, the company offers SGT MOSFETs, digital control chips, gate driver chips and battery-management analog front ends through Hynetek Semiconductor, a company it controls.

These products are used mainly for voltage conversion on the 48V intermediate bus. The company is also seeking to combine power devices, drivers and digital control functions into a unified solution.

Tertiary Power: Supplying GPUs and Other Compute Chips

Tertiary power supplies sit close to GPUs, CPUs and other compute chips in the power delivery chain, and must quickly adjust output voltage and current as chip workloads change.

Roadmap for 800V and Higher-Voltage Architectures

Oriental Semiconductor disclosed its medium- and long-term plans for the server power supply business in the white paper.

In the short term, the company plans to further develop its 48V products, expand its SiC, GaN and digital-control portfolio, and pursue broader adoption of related power devices in liquid-cooled server power supplies.

Its medium-term plans include commercializing an 800V power architecture, researching power devices rated for 1,500V and above, and developing integrated packaging for power devices and control circuits.

Longer term, the company plans to develop integrated power modules, explore vertical power delivery architectures, and strengthen the coordinated design of liquid cooling systems and server power supplies.

The 800V and 1,500V architectures and next-generation integrated power modules remain part of the company’s technology roadmap and do not indicate that the products have already been commercialized or deployed at scale.

AI Servers Drive Power Architecture Upgrades

The white paper argues that rising rack-level power and chip thermal design power are increasing requirements for conversion efficiency, power density and thermal management in AI server systems.

Power typically passes through multiple stages of voltage conversion between the grid input and compute chips such as GPUs. Raising supply voltages, shortening power delivery paths and strengthening digital control have become key development priorities for server power systems.

Oriental Semiconductor said its power devices for liquid-cooled computing power servers have entered volume production and delivery. However, the white paper did not disclose specific customers, revenue or shipment volumes, meaning progress in the business will need to be assessed through subsequent announcements and financial disclosures.