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Every story across China’s AI compute stack — infrastructure, supply chain, foundation models, and the companies behind them.

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RISC-V Chip Startup Yixing Intelligence Hits 15 Billion Yuan Valuation After New Funding
Sep 21, 2026

RISC-V Chip Startup Yixing Intelligence Hits 15 Billion Yuan Valuation After New Funding

Yixing Intelligence has raised nearly 2 billion yuan at a post-money valuation close to 15 billion yuan, with its Epoch RISC-V cloud AI chips now in mass production and large-scale delivery. The company has deployed its first 64-chip supernode cluster at a telecom operator's data center in Shijiazhuang and says its next-generation chip has completed tape-out.

D-Robotics Lands $400M to Expand Sunrise Robot Chips and Software Stack
Sep 21, 2026

D-Robotics Lands $400M to Expand Sunrise Robot Chips and Software Stack

D-Robotics, a Horizon Robotics spin-off supplying robot compute platforms, closed a $400 million Series C led by Mirae Asset with strategic backing from Meituan. The company says cumulative Sunrise chip shipments have topped 8 million as it builds a full-stack embodied AI software platform.

Anew Labs Raises $290 Million as ByteDance Keeps Control of AI Drug Discovery Spinout
Sep 21, 2026

Anew Labs Raises $290 Million as ByteDance Keeps Control of AI Drug Discovery Spinout

Anew Labs, ByteDance's AI drug discovery spinout, has closed a $290 million first external round at a roughly $1.5 billion valuation while unveiling its agent-based AnewDDE platform. Parallel moves from GenScript and Twist Bioscience point to AI pharma competition shifting toward integrated model, data and wet lab capacity.

70% of Flaws Found in China's Large Model Security Testing Are AI-Specific
Sep 18, 2026

70% of Flaws Found in China's Large Model Security Testing Are AI-Specific

China's 2026 crowd-sourced security testing program for AI large models found 873 vulnerabilities across 54 domestic large model and agent applications, with 70% specific to models and agents. Organizers named standout products in open-source models, model applications, and Claw-style agent tracks.

Shengshu Technology Launches Vidu S2 with Real-Time Video Generation, Editing and Spatial Video
Sep 16, 2026

Shengshu Technology Launches Vidu S2 with Real-Time Video Generation, Editing and Spatial Video

Shengshu Technology has released Vidu S2, a real-time video model that comes in two variants: S2-Avatar for interaction with digital characters, and S2-Editing for editing video streams. The new model supports real-time 720P output, lets users inject reference images mid-generation, and can adjust clothing, subjects, backgrounds and visual style in a video on the fly. The team also demonstrated spatial video generation and editing aimed at VR headsets.

China's Homegrown Supercomputing Cluster Sharpens Global Weather Model to 5 Kilometers
Sep 16, 2026

China's Homegrown Supercomputing Cluster Sharpens Global Weather Model to 5 Kilometers

China's in-house MCV numerical model now completes a global 10-day forecast at 5-kilometer resolution in under an hour on Sugon's fully domestic Sugon 8000 AI supercomputing cluster, down from an estimated 21 hours on a traditional CPU architecture. The project team credits heterogeneous computing, communication and storage optimizations for a more than 20-fold efficiency gain.

Two Ministries Explain the 15th Five-Year Plan for the Electronic Information Manufacturing Industry: Revenue at Above 30 Trillion Yuan by 2030
Sep 15, 2026

Two Ministries Explain the 15th Five-Year Plan for the Electronic Information Manufacturing Industry: Revenue at Above 30 Trillion Yuan by 2030

The Ministry of Industry and Information Technology and the National Development and Reform Commission have jointly issued the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry. The plan calls for annual revenue at above 30 trillion yuan for large-scale electronic information manufacturing companies by 2030, R&D spending to reach 3.5% of revenue, and 17 key initiatives spanning integrated circuits, advanced computing, AI chips and terminals, among other areas.

Yigeyun Raises Nearly 100 Million Yuan in Series B+ Funding to Advance Enterprise AI Agent Governance Platform
Sep 15, 2026

Yigeyun Raises Nearly 100 Million Yuan in Series B+ Funding to Advance Enterprise AI Agent Governance Platform

Yigeyun announced on September 14 that it had raised nearly 100 million yuan in a Series B+ round co-invested by MTR Lab and Northern Light Venture Capital. The funds will support further development of its enterprise governance platform for employees and AI agents, as well as overseas expansion. The company aims to manage enterprise agents through asset discovery, permission controls, identity assignment, behavioral oversight and cost measurement.

Doubao Mobile Assistant Adds Screen-Based Tasks, Personal Memory and Cross-App Actions
Sep 15, 2026

Doubao Mobile Assistant Adds Screen-Based Tasks, Personal Memory and Cross-App Actions

ByteDance has launched the consumer edition of Doubao Mobile Assistant with expanded screen interaction, on-device information retrieval, personal memory and cross-app task execution. The assistant will debut on nubia's NaviX Ultra, while ByteDance says reliability, GUI agents and cross-app integration still need improvement.

Beijing-Tianjin-Hebei Releases AI Computing Supply and Demand Lists, Accelerating an AI Data Center Corridor Around the Capital
Sep 14, 2026

Beijing-Tianjin-Hebei Releases AI Computing Supply and Demand Lists, Accelerating an AI Data Center Corridor Around the Capital

The 2026 China Computing Power Conference runs from September 11 to 13 at the Beijing-Tianjin-Hebei Big Data Innovation and Application Center in Langfang. As part of the program, the Beijing-Tianjin-Hebei Forum on AI Computing and Advanced Manufacturing was held on September 11. The forum saw the official release of the region's AI computing supply and demand lists, designed to connect buyers and sellers of computing power directly and to speed up the convergence of AI computing with advanced manufacturing across the three jurisdictions.

Xiaohongshu's AllSpark Releases Iris: Leading Performance Among Open-Source Search Agents in Its Class
Sep 14, 2026

Xiaohongshu's AllSpark Releases Iris: Leading Performance Among Open-Source Search Agents in Its Class

Xiaohongshu's AllSpark team open-sourced Iris Search Agent weights and evaluation code, with Iris-mini and Iris-pro topping BrowseComp, BrowseComp-ZH, DeepSearchQA and HLE benchmarks in their respective parameter classes.

Kaifa Technology Plans 1.85 Billion Yuan Storage Chip Packaging Expansion, Targets 2.5D and 3DS Advanced Packaging
Sep 11, 2026

Kaifa Technology Plans 1.85 Billion Yuan Storage Chip Packaging Expansion, Targets 2.5D and 3DS Advanced Packaging

SDGI subsidiary Peyton Technology plans to invest 1.85 billion yuan in high-end memory chip packaging and testing, including new 2.5D and 3DS capacity. The projects are due in December 2028 amid modest memory-segment growth, rising borrowings and uncertainty over the industry cycle.

On-Device AI Chip Maker Guangyu Xinchen Raises Series A as TC1000 Enters Mass Production
Sep 11, 2026

On-Device AI Chip Maker Guangyu Xinchen Raises Series A as TC1000 Enters Mass Production

Shanghai-based Guangyu Xinchen has closed a Series A round, bringing its total raised over the past six months to 2 billion yuan. The startup says its first on-device large-model inference chip, the TC1000, has entered mass-production deployment while its second-generation chip moves to tape-out.

AI Chip Designer Enflame Lists in Shanghai With 61.2 Billion Yuan Valuation
Sep 11, 2026

AI Chip Designer Enflame Lists in Shanghai With 61.2 Billion Yuan Valuation

Cloud AI chip designer Enflame Technology listed on the Shanghai Stock Exchange's STAR Market on September 11, 2026, pricing its offering at 142.18 yuan per share for a post-offering market value of about 61.187 billion yuan. The company remains unprofitable, with related-party sales to Tencent making up 83.79% of 2025 revenue.

Where China’s AI Startup Funding Flowed in the First Half of 2026
Sep 10, 2026

Where China’s AI Startup Funding Flowed in the First Half of 2026

Zhidx counted 77 Chinese AI funding deals worth at least 100 million yuan in the first half of 2026, totaling about 126.2 billion yuan, while a broader IT Juzi tally put startup funding above 300 billion yuan. Capital concentrated in foundation models, AI applications, compute infrastructure, embodied intelligence and chips.

Rack Supply Tightens at China’s Western Computing Hubs
Sep 10, 2026

Rack Supply Tightens at China’s Western Computing Hubs

Data center construction is accelerating in Qingyang and Zhongwei as operators seek to meet strong demand for high-density racks. Builders still face thin leasing margins, rising infrastructure costs and estimated investment payback periods of eight to 10 years.

Superxon Unveils 1.6T Optical Module and High-Power ELSFP at CIOE 2026
Sep 9, 2026

Superxon Unveils 1.6T Optical Module and High-Power ELSFP at CIOE 2026

Superxon showcased a prototype 1.6T optical module and high-power ELSFP external laser sources designed for AI data-center interconnects and NPO/CPO architectures at CIOE 2026. The company also displayed 800G, 400G and PON products.

China Issues National Standard for Cold-Plate Data Center Cooling
Sep 9, 2026

China Issues National Standard for Cold-Plate Data Center Cooling

China’s GB/T 48023—2026 standard establishes technical and testing requirements for cold-plate liquid cooling systems across data center design, deployment and operations. The standard is scheduled to take effect on February 1, 2027.

Beyond Stacking GPUs: Ruijie Networks’ Vision for AI Infrastructure
Sep 9, 2026

Beyond Stacking GPUs: Ruijie Networks’ Vision for AI Infrastructure

Ruijie Networks argues that AI supernodes require more than simply adding GPUs, highlighting a broader approach to AI compute infrastructure. The article body was not provided, so specific technologies and claims could not be assessed.

DeepSeek Pursues Maximum “Intelligence Density
Sep 9, 2026

DeepSeek Pursues Maximum “Intelligence Density

DeepSeek is testing whether its new Flash model can replace Pro and will cut Flash prices on September 10. Following an earlier R1 upgrade, AI model companies are reshuffling their premium capabilities. DeepSeek is pursuing efficiency on several fronts, though the results remain to be seen.

AI Social Apps Report 12-Fold Revenue Growth as WeChat Enters
Sep 9, 2026

AI Social Apps Report 12-Fold Revenue Growth as WeChat Enters

AI social products are gaining commercial traction, with the article claiming a 12-fold increase in revenue and WeChat’s entry into the market. The full scope and supporting details could not be assessed because no article body was provided.

China’s AI Compute Prices Rise as Demand Outpaces Hardware Supply
Sep 8, 2026

China’s AI Compute Prices Rise as Demand Outpaces Hardware Supply

Some Chinese cloud and AI service providers have reportedly raised compute prices by more than 30% as inference demand grows and supplies of high-end chips and memory remain constrained. The effects are spreading across data centers, hardware suppliers, compute lessors and AI application developers.

Karrie International Starts Mass Production of Vera Rubin Chassis and Rack Products
Sep 8, 2026

Karrie International Starts Mass Production of Vera Rubin Chassis and Rack Products

Karrie International says it has begun mass production and deliveries of chassis and rack-level mechanical products supporting NVIDIA’s Vera Rubin platform. The Hong Kong-listed manufacturer is also expanding its ASIC server business, although it disclosed no customers, order values or shipment volumes.

Tencent Opens WorkBuddy Agent Platform to Developers and Hardware Makers
Sep 6, 2026

Tencent Opens WorkBuddy Agent Platform to Developers and Hardware Makers

Tencent has launched the WorkBuddy open agent platform for developers, application providers and hardware manufacturers. The company says the ecosystem has more than 100 initial partners, nine co-branded hardware products and over 30 applications across more than 20 fields.

H3C Details Open Supernode and High-Speed Interconnect Plans at ODX 2026
Sep 6, 2026

H3C Details Open Supernode and High-Speed Interconnect Plans at ODX 2026

H3C showcased supernode interfaces, high-speed interconnects, 800V HVDC power, liquid cooling and AI data center networking solutions at ODX 2026 in Beijing. Several performance figures and interoperability capabilities remain company claims or future development targets pending real-world validation.

China’s AI Compute Boom Lifts Servers, Optical Modules and Storage
Sep 3, 2026

China’s AI Compute Boom Lifts Servers, Optical Modules and Storage

Chinese listed companies across the AI compute supply chain reported strong first-half 2026 growth as server, optical-module and storage orders moved into delivery. Rising inventories and long acceptance cycles, however, leave cash flow and capital turnover as key tests of sustainability.

Yutai Micro revises private placement plan, seeking 689 million yuan to develop high-speed interconnect chips for data centers
Sep 3, 2026

Yutai Micro revises private placement plan, seeking 689 million yuan to develop high-speed interconnect chips for data centers

On Sept. 2, 2026, Yutai Micro released the second revised draft of its feasibility analysis report on the use of proceeds from its 2026 A-share offering to targeted investors. The company plans to raise no more than 688.9528 million yuan. After deducting issuance expenses, the proceeds will go toward two projects: research and development of high-speed interconnect solutions for data centers, and the development and commercialization of high-speed automotive communication chips.

Oriental Semiconductor Releases White Paper on AI Server Power Supply Systems
Sep 3, 2026

Oriental Semiconductor Releases White Paper on AI Server Power Supply Systems

Oriental Semiconductor has outlined a portfolio of power devices and digital control chips for AI server power systems, spanning PSUs, intermediate bus converters and voltage regulator modules. Its roadmap includes expanded 48V products, an 800V architecture and research into devices rated at 1,500V and above.

Alibaba’s Qoder Launches Glasses Edition for Voice-Controlled Coding Tasks
Sep 3, 2026

Alibaba’s Qoder Launches Glasses Edition for Voice-Controlled Coding Tasks

Alibaba’s Qoder has opened targeted testing for a glasses-based edition that connects initially to Qwen AI Glasses and Rokid AI Glasses. The product is designed to support voice-controlled coding tasks, camera-based context capture and task monitoring, with a broader release planned for the September 2026 Yunqi Conference.

Samsung Showcases Three Storage Solutions for AI Infrastructure in Beijing
Sep 3, 2026

Samsung Showcases Three Storage Solutions for AI Infrastructure in Beijing

Samsung Semiconductor showcased the PM1763, BM1773 and zNAND-O at ODX 2026 in Beijing, targeting the performance, capacity and cost requirements of next-generation AI infrastructure.

Envicool Showcases Full-Rack Liquid Cooling Solution at ODX 2026, Covering Cold Plates, Piping and Cooling Systems
Sep 3, 2026

Envicool Showcases Full-Rack Liquid Cooling Solution at ODX 2026, Covering Cold Plates, Piping and Cooling Systems

Envicool showcased a full-chain liquid cooling portfolio for high-density AI servers and data centers at Beijing’s ODX 2026, including cold plates, connectors, manifolds and prefabricated piping.

China's Compute-Leasing Boom Faces a Reality Check in 2026 Interim Results
Sep 2, 2026

China's Compute-Leasing Boom Faces a Reality Check in 2026 Interim Results

A midyear review examines the performance of major players in China’s AI compute-rental market. The article body is unavailable, so specific companies, figures and results could not be assessed.

China's Chip-Equipment Makers Push Deeper Into Advanced Production
Sep 2, 2026

China's Chip-Equipment Makers Push Deeper Into Advanced Production

Chinese semiconductor-equipment makers are expanding from etching into deposition, cleaning, polishing and process-control tools as chipmakers seek more domestic suppliers. Progress remains uneven, especially in advanced lithography, but growing fab investment and AI demand are creating new opportunities for local equipment companies.

China AI Data Centers Move Toward Gigawatt Scale
Aug 9, 2026

China AI Data Centers Move Toward Gigawatt Scale

China’s AI data center buildout is moving into gigawatt-scale projects, led by major hubs such as Ulanqab and Zhongwei. The article says demand is splitting into tiers, with large training campuses for national and internet companies and smaller local facilities for inference and everyday use.

Musk’s SpaceX Has Yet to Send Data Centers Into Space. China’s GobiX Has Already Landed in the Gobi
Jul 27, 2026

Musk’s SpaceX Has Yet to Send Data Centers Into Space. China’s GobiX Has Already Landed in the Gobi

By Ma Shiqing

The Last Line of Defense for the Tech Bull Market Is Starting to Give Way
Jul 27, 2026

The Last Line of Defense for the Tech Bull Market Is Starting to Give Way

Capital spending was raised, yet the stock fell.

Alibaba Is Finally Seeing Money Come Back
Jul 27, 2026

Alibaba Is Finally Seeing Money Come Back

Investments in MiniMax and Zhipu Are Starting to Pay Off for Alibaba

Google Says Gemini Prompt Uses About 9 Seconds of TV Power, but Experts Dispute the Math
Jul 27, 2026

Google Says Gemini Prompt Uses About 9 Seconds of TV Power, but Experts Dispute the Math

Google published new figures on the energy, water and carbon footprint of a median Gemini text prompt, saying it uses 0.24 watt-hours of electricity and 0.26 milliliters of water. Experts say the report is incomplete, citing missing indirect water use, market-based carbon accounting and limited methodological detail.

Un, the First Large-Scale Generative Model to Use Physics as a Computational Primitive
Jul 27, 2026

Un, the First Large-Scale Generative Model to Use Physics as a Computational Primitive

Over the past decade-plus, GPU-centric digital computing has dominated AI. Bigger clusters, higher bandwidth, more powerful GPUs, and denser data centers have seemed to be the mainstream path toward the next generation of AI.

DeepSeek and Kimi Diverge as Funding Rises
Jul 26, 2026

DeepSeek and Kimi Diverge as Funding Rises

Liang Wenfeng and Yang Zhilin Start Answering Different Questions

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